Semiconductors & Wafer
Measurement tasks in the semiconductor industry require highest accuracy and repeatability. Micro-Epsilon offers the right solution for numerous applications from precise machine positioning and wafer inspection to topographic measurements.
Checking the tilt angle of lens carriers
Capacitive displacement sensors measure the tilt angle of lens carriers to nanometer accuracy. Thanks to the high-precision measurement, a repeatable projection is ensured. Several sensors measure onto ...
Show detailsMonitoring the alignment of lenses using confocal chromatic sensors
Confocal chromatic sensors are used to measure the alignment of the lens. Several sensors measure directly on the lens to detect the tilt angle to nanometer accuracy. Unlike electromagnetic sensors, confocal ...
Show details3D shape measurement of wafers
reflectCONTROL deflectometry systems are used to detect the flatness or planarity of 150 mm wafers. These measure the flatness with only one image. For this purpose, the sensors project a striped ...
Show detailsPositioning the wafer stage using capacitive sensors
Capacitive displacement sensors are used for fine positioning tasks in the wafer stage. These sensors measure the position of the stage at various points, which is particularly useful for fine alignment. ...
Show detailsTilt angle measurement of wafers
The exact position of the wafer plays an important role in wafer handling. During the infeed of wafers, white light interferometers measure the horizontal tilt angle of wafers. Two interferometers ...
Show detailsDetermining the position during wafer handling
When handling wafers, exact and repeatable positioning is crucial. During the infeed of wafers, two optoCONTROL laser micrometers inspect the diameter and thus determine the horizontal position. Thanks ...
Show detailsMonitoring optical systems using wavefront sensors
Shack-Hartmann wavefront sensors from Optocraft measure the alignment state and the imaging quality of the entire optical system. The robust measuring principle allows machine integration and automated ...
Show detailsDimensional inspection of silicon ingots
Laser profile scanners from Micro-Epsilon are used to inspect the geometry of silicon ingots. These detect the complete geometry of the silicon rods. This allows geometrical deviations of the silicon block ...
Show detailsInspection of the orientation notches on silicon ingots
Ingots are often provided with orientation notches, which are necessary for the alignment of the ingots. Blue laser scanners from Micro-Epsilon are used to inspect the profile of the notches for dimensional ...
Show detailsMonitoring the deflection of wire saws
Wire saws are used to cut ingots in only one step. Since the wire is subject to strong wear, the wire bed is monitored at several points using non-contact eddy current sensors. These not only detect the ...
Show detailsMonitoring the axial movement of internal hole saws
Internal hole saws are used for cutting silicon ingots. In order to achieve reliable separation of the ingot, the saw blade or holder is monitored using eddy current sensors. Four sensors measure the distance ...
Show detailsHigh precision thickness measurement of silicon wafers
Capacitive displacement sensors are used for the exact thickness measurement of wafers. Two opposing sensors detect the thickness and also determine other parameters such as deflection or sawing marks. ...
Show detailsRecognition and measurement of bumps on silicon wafers
Confocal chromatic displacement sensors from Micro-Epsilon are used to inspect bumps. They generate a small light spot onto the wafer, while reliably detecting the smallest of parts and structures at high ...
Show detailsBow and warp of wafers
Confocal chromatic sensors scan the wafer surface to detect bow, warp and distortion. Providing a measuring rate of 70 kHz, confocalDT controllers enable highly dynamic measurements, allowing the wafer ...
Show detailsDetection and measurement of saw marks
For automatic detection and measurement of saw marks, confocal chromatic sensors from Micro-Epsilon are used. The fast surface compensation feature of the controller regulates the exposure cycles in order ...
Show detailsInspection of cracks and breakages
Confocal chromatic sensors from Micro-Epsilon are used to detect cracks and other defects on the wafer. They reliably detect surfaces with varying reflection characteristics due to a fast surface compensation ...
Show detailsTransparent layers & adhesive beading
Confocal chromatic sensors are used for one-sided layer thickness measurements. The confocal measuring principle enables the evaluation of several signal peaks, allowing the thickness of transparent materials ...
Show detailsWafer thickness measurement / TTV
Confocal chromatic sensors measure the thickness deviation (Total Thickness Variation) and the wafer thickness from both sides. Based on the wafer thickness profile, bow and warp of the wafer can be detected. ...
Show detailsPositioning of the lens system in lithography machines
Non-contact, inductive displacement sensors (eddy current) measure the position of lens elements in order to achieve the highest possible imaging accuracy. Depending on the lens system, displacement sensors ...
Show detailsPositioning the wafer stage
Non-contact sensors from Micro-Epsilon are used for position monitoring of the wafer stage, where they measure highly dynamic XYZ movements of the stage which accelerates very rapidly. Capacitive and inductive ...
Show detailsPositioning the wafer stage using white light interferometers
The white light interferoMETER IMS5600 from Micro-Epsilon is used for position monitoring of the wafer stage. It measures the XYZ movements of the stage with extremely high accelerations. The high-precision ...
Show detailsNanometer positioning in lithography machines
To illuminate individual components on the wafer, the lithographic devices move the wafer to the respective position. Capacitive displacement sensors measure the position of the travel path in order to ...
Show detailsPositioning of masks in lithography
Lithography processes require high resolution and long-term measurement of machine movements in order to achieve maximum precision. High resolutions enable nanometer-precise positioning of masks using ...
Show detailsWhite light interferometer for mask positioning in lithography
Lithography processes require high resolution and long-term stable measurement of machine movements in order to achieve maximum precision. Thanks to special evaluation algorithms and active temperature ...
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